JAYA JAYA SANKARA HARA HARA SANKARA Thermal and Power Challenges in High Performance Computing Systems

This paper provides an overview of the thermal and power challenges in emerging high performance computing platforms. The advent of new sophisticated applications in highly diverse areas such as health, education, finance, entertainment etc. is driving the platform and device requirements for future systems. The key ingredients of future platforms are vertically integrated (3D) die-stacked devices which provide the required performance characteristics with the associated form factor advantages. Two of the major challenges to the design of TSV-based (through-silicon-via) 3D stacked technologies are (i) effective thermal management and (ii) efficient power delivery mechanisms. Some of the key challenges that are articulated in this paper include hot-spot superposition and intensification in a 3D stack, design/optimization of TTSVs (Thermal Through Silicon Vias), non-uniform power loading of multi-die stacks, efficient on-chip power delivery, minimization of electrical hotspots etc.